JPH0195780U - - Google Patents

Info

Publication number
JPH0195780U
JPH0195780U JP19302087U JP19302087U JPH0195780U JP H0195780 U JPH0195780 U JP H0195780U JP 19302087 U JP19302087 U JP 19302087U JP 19302087 U JP19302087 U JP 19302087U JP H0195780 U JPH0195780 U JP H0195780U
Authority
JP
Japan
Prior art keywords
electrodes
wiring
dividing line
electrolytic plating
crosses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19302087U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19302087U priority Critical patent/JPH0195780U/ja
Publication of JPH0195780U publication Critical patent/JPH0195780U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Electronic Switches (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
JP19302087U 1987-12-17 1987-12-17 Pending JPH0195780U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19302087U JPH0195780U (en]) 1987-12-17 1987-12-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19302087U JPH0195780U (en]) 1987-12-17 1987-12-17

Publications (1)

Publication Number Publication Date
JPH0195780U true JPH0195780U (en]) 1989-06-26

Family

ID=31483840

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19302087U Pending JPH0195780U (en]) 1987-12-17 1987-12-17

Country Status (1)

Country Link
JP (1) JPH0195780U (en])

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